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Mise à jour Procédé DUV et EUV

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Fabrication du Numérique 2025-05-09 06:58:28 +02:00
parent 8710014345
commit d57cb1f0e2
1 changed files with 5 additions and 5 deletions
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schema.txt
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@ -14709,7 +14709,7 @@ digraph Hierarchie_Composants_Electroniques_Simplifiee {
PaysBas_Assemblage_ProcedeDUV [fillcolor="#e6f2ff", label="Pays-Bas", niveau="1011"];
// Relations sortantes du nœud de niveau 11
PaysBas_Assemblage_ProcedeDUV -> AMSL_PaysBas_Assemblage_ProcedeDUV [color="purple", fontcolor="purple", label="100%", poids="2"];
PaysBas_Assemblage_ProcedeDUV -> AMSL_PaysBas_Assemblage_ProcedeDUV [color="purple", fontcolor="purple", label="84%", poids="2"];
AMSL_PaysBas_Assemblage_ProcedeDUV [fillcolor="#d1e0ff", label="ASML", niveau="1012"];
// Relations des nœuds destination
@ -14721,7 +14721,7 @@ digraph Hierarchie_Composants_Electroniques_Simplifiee {
label="Japon_Assemblage_ProcedeDUV";
fillcolor="#e6f2ff";
style="filled";
PaysBas_Assemblage_ProcedeDUV [fillcolor="#e6f2ff", label="Pays-Bas", niveau="1011"];
Japon_Assemblage_ProcedeDUV [fillcolor="#e6f2ff", label="Pays-Bas", niveau="1011"];
// Relations sortantes du nœud de niveau 11
Japon_Assemblage_ProcedeDUV -> Nikon_Japon_Assemblage_ProcedeDUV [color="purple", fontcolor="purple", label="12%", poids="2"];
@ -14754,7 +14754,7 @@ digraph Hierarchie_Composants_Electroniques_Simplifiee {
Assemblage_ProcedeEUV [fillcolor="#ffd699", ihh_acteurs="100", ihh_pays="100", label="Assemblage", niveau="1010"];
// Relations sortantes du nœud de niveau 10
Assemblage_ProcedeEUV -> PaysBas_Assemblage_ProcedeEUV [color="purple", fontcolor="purple", label="84%", poids="2"];
Assemblage_ProcedeEUV -> PaysBas_Assemblage_ProcedeEUV [color="purple", fontcolor="purple", label="100%", poids="2"];
subgraph cluster_PaysBas_Assemblage_ProcedeEUV {
label="PaysBas_Assemblage_ProcedeEUV";